SMB1360 Evaluation Board User Guide [80-NH006-3 Rev. B ed.]

Citation preview

SMB1360 Evaluation Board User Guide 80-NH006-3 Rev. B September 12, 2014

Submit technical questions at: https://support.cdmatech.com

Confidential and Proprietary – Qualcomm Technologies, Inc. NO PUBLIC DISCLOSURE PERMITTED: Please report postings of this document on public servers or websites to: [email protected]. Restricted Distribution: Not to be distributed to anyone who is not an employee of either Qualcomm or its subsidiaries without the express approval of Qualcomm’s Configuration Management. Not to be used, copied, reproduced, or modified in whole or in part, nor its contents revealed in any manner to others without the express written permission of Qualcomm Technologies, Inc. Qualcomm is a trademark of QUALCOMM Incorporated, registered in the United States and other countries. All QUALCOMM Incorporated trademarks are used with permission. Other product and brand names may be trademarks or registered trademarks of their respective owners. This technical data may be subject to U.S. and international export, re-export, or transfer (“export”) laws. Diversion contrary to U.S. and international law is strictly prohibited.

Qualcomm Technologies, Inc. 5775 Morehouse Drive San Diego, CA 92121 U.S.A. © 2013-2014 Qualcomm Technologies, Inc.

Revision history Revision

Date

AA

November 2013

Initial release

B

September 2014

 Section 1.1 Features: Updated features  Figure 1-1 SMB1360 evaluation board (top): Updated image with new evaluation board  Figure 1-2 SMB1360 evaluation board (bottom): Added image  Chapter 3 Running the GUI: Updated GUI start-up information for version 1.7  Figure 3-1 GUI startup screen Figure 3-15: Updated screenshots for GUI version 1.7  Section 3.1 Navigating the GUI: Updated information  Section 3.3 through Section 3.3.10: Updated information in each section for GUI revision 1.7  Chapter 4 Bench Evaluation: Changed the title from Beginning Evaluation to Bench Evaluation  Figure 4-1 Evaluation board schematic: Updated image  Figure 4-2 through Figure 5-12: Updated images with screenshots of new board  Section 5.7 Test points: Added information on test points  Chapter 6 PCB Layout, Chapter 7 Bill of Materials, and Chapter 8 USB Dongle and Cable: Added chapters

80-NH006-3 Rev. B

Description

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

2

Contents

1 Introduction...................................................................................................... 7 1.1 Features ......................................................................................................................... 7 1.2 Contents of evaluation kit ............................................................................................. 8

2 Getting Started................................................................................................. 9 3 Running the GUI ............................................................................................ 11 3.1 Navigating the GUI ..................................................................................................... 12 3.2 Memory structure overview ........................................................................................ 13 3.3 GUI walkthrough (tabs) .............................................................................................. 14 3.3.1 Charging parameters ........................................................................................ 14 3.3.2 Charging settings ............................................................................................. 15 3.3.3 Input control..................................................................................................... 16 3.3.4 OTG settings .................................................................................................... 17 3.3.5 System operation ............................................................................................. 18 3.3.6 Status ............................................................................................................... 19 3.3.7 Therm............................................................................................................... 20 3.3.8 Fuel gauge........................................................................................................ 21 3.3.9 Factory programmable settings ........................................................................ 23 3.3.10 I2C interfacing ................................................................................................ 24

4 Bench Evaluation .......................................................................................... 25 4.1 Input voltage connection ............................................................................................. 25 4.2 I2C connection............................................................................................................. 26

5 SMB1360 Evaluation Board – CSP ............................................................... 27 5.1 Battery connection ...................................................................................................... 27 5.2 Output voltage............................................................................................................. 29 5.3 ENABLE_C/SHUTDOWN ........................................................................................ 30 5.4 Battery voltage sensing ............................................................................................... 31 5.5 Battery current sensing ............................................................................................... 32 5.6 Auxiliary LDO ............................................................................................................ 32 5.7 Test points ................................................................................................................... 32 5.7.1 VCHG .............................................................................................................. 33 5.7.2 Thermistor and RBIAS .................................................................................... 33 5.7.3 AC/USB ........................................................................................................... 35 5.7.4 SYS_OK .......................................................................................................... 36

6 PCB Layout .................................................................................................... 37

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

3

SMB1360 Evaluation Board User Guide

Contents

7 Bill of Materials .............................................................................................. 43 8 USB Dongle and Cable .................................................................................. 45

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

4

SMB1360 Evaluation Board User Guide

Contents

Figures Figure 1-1 SMB1360 evaluation board (top) ............................................................................................... 8 Figure 1-2 SMB1360 evaluation board (bottom) ......................................................................................... 8 Figure 2-1 GUI installation screen ............................................................................................................... 9 Figure 2-2 GUI installation target directory ................................................................................................ 9 Figure 2-3 Confirm installation.................................................................................................................. 10 Figure 2-4 GUI installation complete ........................................................................................................ 10 Figure 3-1 GUI startup screen .................................................................................................................... 11 Figure 3-2 GUI startup ............................................................................................................................... 12 Figure 3-3 Radio button enables greyed out options ................................................................................. 12 Figure 3-4 Mouse roll over information box ............................................................................................. 13 Figure 3-5 Charging parameter tab ............................................................................................................ 14 Figure 3-6 Charging settings tab ................................................................................................................ 15 Figure 3-7 Input control tab ....................................................................................................................... 16 Figure 3-8 OTG setting tab ........................................................................................................................ 17 Figure 3-9 System operation tab ................................................................................................................ 18 Figure 3-10 Status tab ................................................................................................................................ 19 Figure 3-11 Therm tab ............................................................................................................................... 20 Figure 3-12 Fuel gauge tab with fuel gauge configuration displayed ........................................................ 21 Figure 3-13 Fuel gauge tab with fuel gauge status displayed .................................................................... 22 Figure 3-14 Factory program setting tab.................................................................................................... 23 Figure 3-15 I2C interfacing tab .................................................................................................................. 24 Figure 4-1 Evaluation board schematic ..................................................................................................... 25 Figure 4-2 Input voltage connection .......................................................................................................... 26 Figure 4-3 I2C dongle connection .............................................................................................................. 26 Figure 5-1 SMB1360 CSP ......................................................................................................................... 27 Figure 5-2 4-pin connector......................................................................................................................... 28 Figure 5-3 Battery voltage test points ........................................................................................................ 28 Figure 5-4 Output voltage .......................................................................................................................... 29 Figure 5-5 Enable/shutdown switch........................................................................................................... 30 Figure 5-6 Battery voltage sensing ............................................................................................................ 31 Figure 5-7 Test points to monitor battery current ...................................................................................... 32 Figure 5-8 VCHG test point ....................................................................................................................... 33 Figure 5-9 Jumper (J102 and J105)............................................................................................................ 34 Figure 5-10 THERM and RBIAS test points ............................................................................................. 34 Figure 5-11 AC/USB connectors ............................................................................................................... 35 Figure 5-12 SYS_OK test point ................................................................................................................. 36 Figure 6-1 Top layer PCB (no silkscreen) ................................................................................................. 37 Figure 6-2 Inner layer 1 ............................................................................................................................. 38 Figure 6-3 Inner layer 2 ............................................................................................................................. 39 Figure 6-4 Inner layer 3 ............................................................................................................................. 40 Figure 6-5 Inner layer 4 ............................................................................................................................. 41 Figure 6-6 Bottom layer ............................................................................................................................. 42 80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

5

SMB1360 Evaluation Board User Guide

Contents

Figure 8-1 USB A to micro B cable and connectors .................................................................................. 45 Figure 8-2 USB to I2C dongle .................................................................................................................... 45

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

6

1 Introduction

This document provides instructions on how to operate the SMB1360 evaluation board. The evaluation board includes both WLP and QFN (factory evaluation only; not in production) versions of the SMB1360 IC, in two separate sections of the PCB (see Figure 1-1). Silkscreened white lines make the sections. This document will cover the WLP section only.

1.1 Features

80-NH006-3 Rev. B



Programmable switching charger



Automatic input current limit (AICL)



USB or AC adapter input with programmable input current limiting



Up to 1.5 A continuous charging current from AC adapter



Up to 750 mA charging current from 500 mA USB port using automatic TurboCharge™



+4.0–6.3 V input range (+28 V input protected)



Integrated USB On-the-Go (OTG) and MHL/HDMI power support (+5.0 V reverse output at 750 mA)



50 mA LDO output provides power to external USB communication devices



Analog output voltage for direct charge current measurement



Reverse current blocking



High-efficiency 2 MHz or 3.2 MHz current-mode step-down regulator



No external compensation components



Integrated power MOSFETs



High accuracy float voltage regulation of 1%



Status register monitors charger operation and flags fault conditions



Programmable fuel gauge



Accurate battery state-of-charge estimation



Optimized mixed algorithm with current and voltage monitoring



Precise battery voltage, current temperature, and aging compensation



Battery calibration cycling is not required to maintain accuracy



Missing battery detection



Digital programming of all major parameters via I2C interface

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

7

SMB1360 Evaluation Board User Guide

Introduction

1.2 Contents of evaluation kit 1. SMB1360 evaluation board 2. SMB1360 evaluation kit user’s guide 3. USB cable, type A to micro B connectors 4. USB to I2C gen2 dongle

SMB1360 CSP

SMB1360 QFN (not stuffed)

Figure 1-1 SMB1360 evaluation board (top)

Figure 1-2 SMB1360 evaluation board (bottom) 80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

8

2 Getting Started

Before beginning the evaluation of the SMB1360, the GUI software needs to be installed. To install the GUI, double-click the setup.exe file. The information window shown in Figure 2-1 will appear, click Next.

Figure 2-1 GUI installation screen The next screen (Figure 2-2) selects the destination folder that the GUI resides in. This location is where all the drivers for the GUI are located. By default the destination folder is C:\Program Files (x86)\Qualcomm Technologies Inc\Qualcomm SMB1360 GUI\SMB1360 GUI. Click Next to continue the installation. Click Next again to confirm.

Figure 2-2 GUI installation target directory

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

9

SMB1360 Evaluation Board User Guide

Getting Started

Figure 2-3 Confirm installation Once the GUI installation is complete, the following prompt will appear (Figure 3-1). Click Close to complete the installation.

Figure 2-4 GUI installation complete

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

10

3 Running the GUI

Before running the GUI, insert the keyed USB-to-I2C dongle into an open PC USB host port (not a USB hub) using the provided type-A connector on the USB cable. Connect the other end of the USB micro-B connector to the I2C dongle, which is plugged into the SMB1360 evaluation board (see Figure 8-1 and Figure 8-2). To start the GUI, navigate to the Start button, and then to Programs, and under the Qualcomm Power Management Interface, select the SMB1360 GUI. The launch screen shown in Figure 3-1 appears.

Figure 3-1 GUI startup screen When the GUI first appears (Figure 3-2), the Charging Parameters tab is displayed. It should be noted that initially all options are greyed out. Click the Load Standard Settings button to fill the GUI options with the default parameters or perform a Read configuration to read back the volatile memory of the SMB1360 device which is loaded on the evaluation board.

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

11

SMB1360 Evaluation Board User Guide

Running the GUI

Figure 3-2 GUI startup

3.1 Navigating the GUI The SMB1360 GUI is divided into separate tabs that have common features displayed in each. Each tab allows the user to change various parameters and functions of the SMB1360 device in volatile memory, and display how each feature changes the charging behavior. Under each tab, some options may appear to be grayed out. As shown in Figure 3-3, the SMB1360 offers the option to disable the internal termination current detection to allow host controlled termination detection. When current termination is enabled, the termination currents are not grayed out and can be selected.

Figure 3-3 Radio button enables greyed out options Another convenient feature is the ability to point the mouse to a programmable option which opens an information box displaying a description of the selected option (Figure 3-4).

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

12

SMB1360 Evaluation Board User Guide

Running the GUI

Figure 3-4 Mouse roll over information box

3.2 Memory structure overview The memory structure for the SMB1360 device is divided into four sections; configuration, trim, command, and status registers. The configuration registers have a non-volatile and volatile memory array. The non-volatile memory array or default configuration is custom programmed as part of the manufacturing process and this programming information is given to Qualcomm Technologies, Inc. (QTI) in the form of a HEX file. The creation of this hex file is discussed in greater detail in Section 3.3.9. The non-volatile array is thought of as the safe (initial) configuration, and ensures that anytime power is removed from the input, the default configuration is reloaded. The volatile registers are written to and read from using the standard I2C commands and are used to change system and charging parameters on the fly. These include charge currents, float voltage, and many other parameters. The register contents remain in the volatile memory as long as there is power on the input or the battery output. However, when an input is removed the defaults are automatically loaded. This is necessary for ensuring USB compliance: each time a USB connector is inserted, the system needs to re-enumerate. If the previous input was a dedicated wall charger charging at 650 mA and the new input is a USB hub able to only supply 100 mA, it is obvious that starting in a safe configuration is valuable. The trim registers are programmed by QTI and contain options that do not need to be changed on the fly, such as USB3.0 compliant input current limits, rather than USB2.0 compliant. These are factory programmed and cannot be read or changed by the user, but can be selected in the GUI and then subsequently saved in the HEX file. The command registers control the immediate actions of the part, such as whether to enable or disable charging, or to charge in USB 100 mA mode or 500 mA mode, etc. These registers can be written to and read from, and are reset to all zeros when the input is removed. The status registers give real time information as to what is happening in the system. Various status and fault registers include charge state (precharge, fast-charge, or taper), various errors, and input power source information.

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

13

SMB1360 Evaluation Board User Guide

Running the GUI

3.3 GUI walkthrough (tabs) The GUI shows all parameters and functions that can be changed or programmed on the SMB1360 device. The GUI is divided into 11 tabs. Sections 3.3.1–3.3.7 reviews each of these tabs.

3.3.1 Charging parameters The Charging Parameters tab (Figure 3-5) contains the controls for all of the charging parameters available on the SMB1360 device including fast charging (CC) currents and final float voltage (CV). This page is compartmentalized such that like items are located next to one another.

Figure 3-5 Charging parameter tab

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

14

SMB1360 Evaluation Board User Guide

Running the GUI

3.3.2 Charging settings The Charging Settings tab (Figure 3-6) controls how the system interacts with the SMB1360 device to enable and disable charging and to monitor the charge status, STAT pin, charge safety timers, etc.

Figure 3-6 Charging settings tab

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

15

SMB1360 Evaluation Board User Guide

Running the GUI

3.3.3 Input control The Input Control tab (Figure 3-7) provides the controls for options related to input current limiting; DCIN input current limits, AICL detection, AICL glitch filter timing, and more.

Figure 3-7 Input control tab

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

16

SMB1360 Evaluation Board User Guide

Running the GUI

3.3.4 OTG settings The OTG Settings tab (Figure 3-8) provides controls for the OTG features including battery current limit, battery UVLO, and UVLO sensor source.

Figure 3-8 OTG setting tab

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

17

SMB1360 Evaluation Board User Guide

Running the GUI

3.3.5 System operation The System Operation tab (Figure 3-9) contains the options for controlling the SYS_OK, enabling/disabling SYS LDO output, charger switching frequency, charger watchdog timer, battery ID, and fuel gauge ESR current settings.

Figure 3-9 System operation tab

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

18

SMB1360 Evaluation Board User Guide

Running the GUI

3.3.6 Status The Status tab (Figure 3-10) displays the interrupt (IRQ) outputs. Any active fault generates an IRQ, regardless of the active fault status. The interrupt is identified under the IRQ heading while fault active or non-active status is provided under the Current heading. An example of this is the IRQ option for the hot/cold soft limit. Assume the battery pack increases in temperature and trips the hot soft limit temperature threshold. An IRQ is asserted, and the STAT pin toggles. When Read Status is selected both hot soft limit interrupt, and hot soft limit status are displayed in the IRQ and Current headings. This tells the system that the IRQ was due to a Hot Soft Limit, and the SMB1360 is still in a hot soft limit. The IRQ is automatically cleared after the Read Status is selected. Therefore, a subsequent read will only display the Current status – unless a subsequent interrupt is triggered. When the battery pack temperature begins to cool and then falls below the hot soft limit threshold, the IRQ is asserted and the STAT pin is toggled. When he Read Status is selected, the hot soft limit IRQ is asserted, but hot soft limit as state (current) is no longer active. This IRQ is cleared when the Read Status is selected.

Figure 3-10 Status tab

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

19

SMB1360 Evaluation Board User Guide

Running the GUI

3.3.7 Therm The Therm tab (Figure 3-11) contains battery pack thermistor monitoring and charger temperature compensation controls.

Figure 3-11 Therm tab

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

20

SMB1360 Evaluation Board User Guide

Running the GUI

3.3.8 Fuel gauge The Fuel Gauge tab contains the fuel gauge register as well as two additional tabs for the fuel gauge configuration and the fuel gauge status. These are explained in more detail in Sections 3.3.8.1 and 3.3.8.2.

3.3.8.1 Fuel gauge configuration The Fuel Gauge Configuration tab (Figure 3-12) contains the fuel gauge factory programmable settings found in the SMB1360 device. These include battery specific parameters such as the system cut-off voltage, charging termination current, and the battery ID settings (used to identify the battery based on the batteries internal BID resistance). The battery voltage and current readings, and the fuel gauge interrupts are also provided.

Figure 3-12 Fuel gauge tab with fuel gauge configuration displayed

3.3.8.2 Fuel gauge status The Fuel Gauge Status tab indicates SoC alerts and miscellaneous status events. The fuel gauge triggered interrupt events are listed under the IRQ heading and existing interrupt status is provided under the Current heading (Figure 3-13)

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

21

SMB1360 Evaluation Board User Guide

Running the GUI

Figure 3-13 Fuel gauge tab with fuel gauge status displayed

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

22

SMB1360 Evaluation Board User Guide

Running the GUI

3.3.9 Factory programmable settings The Factory Prog Settings tab (Figure 3-14) accesses, but cannot over-write, the factory programmed settings found in the SMB1360 device. Once the desired settings are selected, from the Print command in the menu bar, the Print to File command generates a HEX file with the desired factory settings.

Figure 3-14 Factory program setting tab

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

23

SMB1360 Evaluation Board User Guide

Running the GUI

3.3.10 I2C interfacing The I2C Interfacing tab (Figure 3-15) identifies and displays the I2C address used for communication with the SMB1360 I2C slave device.

Figure 3-15 I2C interfacing tab

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

24

4 Bench Evaluation

The following schematic (Figure 4-1) refers to actual components and components’ values placed on the evaluation kit.

Figure 4-1 Evaluation board schematic 80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

25

SMB1360 Evaluation Board User Guide

Bench Evaluation

4.1 Input voltage connection The board is powered in two different ways: 

USB connector (J600): micro-B USB connector



DCIN connectors (DCIN+ and DCIN-): micro-banana jacks, positive (red) and negative (black) connectors. USB+ and GND are provided for power supply’s remote sense connections (J160_1 negative terminal, J160_2 positive terminal).

Input voltage connection is shared between the CSP and QFN section.

Figure 4-2 Input voltage connection

4.2 I2C connection The board is capable of I2C communication through the dedicated J500 connector (Figure 4-3). To enable communication with the part, use the included dongle connector and the provided SMB1360 GUI. Resistor couples R105-106 and R205-R206 are used to selectively enable the I2C communication to the SMB1360 CSP or QFN, respectively.

Figure 4-3 I2C dongle connection

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

26

5 SMB1360 Evaluation Board – CSP

5.1 Battery connection The 4-pins connector (Figure 5-2) serves for battery connection to the board. The pins are organized as follow: 1. GND (battery negative node) 2. RID (battery pack integrated resistor ID) 3. THERM (battery pack integrated thermistor) 4. BATT+ (battery positive node) Two test points are provided, named BATT_N and BATT_P (Figure 5-3), to sense the battery voltage sensing pins at the battery connector. They are not intended to be power connections.

Figure 5-1 SMB1360 CSP

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

27

SMB1360 Evaluation Board – CSP

SMB1360 Evaluation Board User Guide

Figure 5-2 4-pin connector

Figure 5-3 Battery voltage test points

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

28

SMB1360 Evaluation Board – CSP

SMB1360 Evaluation Board User Guide

5.2 Output voltage The SMB1360 CSP is provided with specific connectors for load emulators. Micro-banana jacks are available, named CSP VOUT+ (red) and CSP VOUT- (black); see Figure 5-4. Test points CSP VOUT+ and CSP VOUT- are to be used as either a remote sensing point for a load emulator, or as power connectors. If used as a power connector, it is recommended to limit the output power. J150 headers serve for output voltage differential sensing: voltage is sensed across the output bypass capacitance C122.

Figure 5-4 Output voltage

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

29

SMB1360 Evaluation Board – CSP

SMB1360 Evaluation Board User Guide

5.3 ENABLE_C/SHUTDOWN The SMB1360 CSP is provided with a dedicated hardware pin for enabling the charger or putting the IC into shutdown mode. To enable the hardware pin, place a jumper on the headers J100 (Figure 5-5). The switch, SW100, allows for either enabling the charger (when DCIN is present) or to force the IC into shutdown mode (when DCIN is not present). Toggle the switch pin towards the IC in order to force the EN_C/SHDN pin to voltage HIGH logic level.

Figure 5-5 Enable/shutdown switch

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

30

SMB1360 Evaluation Board – CSP

SMB1360 Evaluation Board User Guide

5.4 Battery voltage sensing To monitor the battery voltage sensed by the IC, the BATT_N and BATT_P test points are provided (Figure 5-6). These test points connect unfiltered to the sensing pins BATT_N and BATT_P. The test points are for monitoring and/or measuring purposes only; no power connections should be used.

Figure 5-6 Battery voltage sensing

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

31

SMB1360 Evaluation Board – CSP

SMB1360 Evaluation Board User Guide

5.5 Battery current sensing To monitor the battery current sensed by the IC, the CS_N and CS_P test points are provided. These test points connect unfiltered directly to the sensing pins CS_N and CS_P on the SMB1360 CSP. Positive voltage drop (from CS_N to CS_P) is reported as discharging current. The header J109 is provided to facilitate differential voltage probing. See Figure 5-7 for the location on the board.

Figure 5-7 Test points to monitor battery current

5.6 Auxiliary LDO The auxiliary LDO is provided with a test point LDO. This test point is used as a power connection to test the LDO under non-zero load conditions.

5.7 Test points All relevant signals from the IC are routed to dedicated test points for testing, monitoring, and validating the proper IC behavior. The majority of the test points are placed on the limit of the board to facilitate probing connection. Sections 5.7.1–5.7.4 gives a brief explanation for each test point on the evaluation kit.

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

32

SMB1360 Evaluation Board – CSP

SMB1360 Evaluation Board User Guide

5.7.1 VCHG The SMB1360 device implements analog battery current reporting. The voltage at VCHG pin is proportional to the battery current sensed across the CS_P and CS_N pins. To monitor the VCHG voltage, connect a multi-meter to the test point named VCHG (Figure 5-8). Refer the measurement to any GND test point on board.

Figure 5-8 VCHG test point

5.7.2 Thermistor and RBIAS The evaluation board is provided with a 10 KΩ SMD thermistor for temperature measurement. Alternatively, the battery pack integrated thermistor can be used by properly enabling the net on the board with two jumpers (Figure 5-9) as described: 1. PCB thermistor: Locate the headers J102 and J105. Place a jumper on header J102 to connect the PCB thermistor. Let the header J105 open. 2. Rbias Conn: Insert the jumper 3. Battery Pack thermistor: Place a jumper on header J105. Let the header J102 open.

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

33

SMB1360 Evaluation Board – CSP

SMB1360 Evaluation Board User Guide

Figure 5-9 Jumper (J102 and J105) The SMB1360, through the RBIAS pin, provides the pull-up voltage for the thermistor net on board. The THERM pin is connected to either the middle node of the R107-R108 voltage divider, or the middle node R107 thermistor pin, on the battery pack. To independently monitor voltage at the RBIAS and THERM pins (Figure 5-10), use RBIAS_2 and THERM_2 test points respectively.

Figure 5-10 THERM and RBIAS test points

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

34

SMB1360 Evaluation Board – CSP

SMB1360 Evaluation Board User Guide

5.7.3 AC/USB The AC/USB pin (Figure 5-11) is used to select the input current limit threshold, either a wall adapter or USB is connected to DCIN. Refer to the SMB1360 Device Specification (80-NH006-1) for more details. Headers J4 allows for connecting the AC/USB either to GND, VOUT, or to leave the pin floating: 

Do not place any jumper on J4 to leave the pin floating



Place a jumper on 1-2 pins to connect the AC/USB pin to VOUT



Place a jumper on 2-3 pins to connect the AC/USB pin to GND

Figure 5-11 AC/USB connectors

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

35

SMB1360 Evaluation Board – CSP

SMB1360 Evaluation Board User Guide

5.7.4 SYS_OK SYS_OK signal (Figure 5-12) can be monitored on the specific SYS_OK test point. Refer to the SMB1360 Device Specification (80-NH006-1) for more details about the SYS_OK signal.

Figure 5-12 SYS_OK test point

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

36

6 PCB Layout

Figure 6-1 Top layer PCB (no silkscreen)

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

37

SMB1360 Evaluation Board User Guide

PCB Layout

Figure 6-2 Inner layer 1

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

38

SMB1360 Evaluation Board User Guide

PCB Layout

Figure 6-3 Inner layer 2

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

39

SMB1360 Evaluation Board User Guide

PCB Layout

Figure 6-4 Inner layer 3

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

40

SMB1360 Evaluation Board User Guide

PCB Layout

Figure 6-5 Inner layer 4

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

41

SMB1360 Evaluation Board User Guide

PCB Layout

Figure 6-6 Bottom layer

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

42

7 Bill of Materials

Table 7-1 Bill of materials Item number

Qty

1

2

PMIC

QTI

SMB1360

U1 U3

2

4

CAP CER, 4.7 µF, 25 V, X5R, 0805

TDK

C2012X5R1E475K125AB

C100 C101 C200 C201

3

2

0.1 µF, 25 V, 10%, X7R, 0402

TDK

CGA2B3X7R1E104K050BB

C103 C203

4

6

1 µF, 6.3 V, 10%, X5R, 0402

Murata

GRM155R60J105KE19D

C110 C111 C130 C210 C211 C230

5

6

10 µF, 6.3 V, CER, 20%, X5R, 0805

Murata

GRM21BR60J106ME19L

C120 C121 C122 C220 C221 C222

6

2

2.2 µF, 35 V, 10%, X5R, 1210

Taiyo Yuden

GMK325BJ225KN-T

C150 C250

7

2

CAP CER, 10 pF, 50 V, NPO, 0402

Kemet

C0402C100J5GACTU

C151 C207

8

1

0.1 µF, 25 V, CER, X5R, 0402

Taiyo Yuden

TMK105BJ104KV-F

C560

Description

Vendor

Vendor part number

Reference designator

9

2

22 µF, 16 V, CER, X5R, 1206, 20%

AVX

1206YD226MAT2A

C600 C601

10

2

LED, red clear, 0805, SMD

Lite on

LTST-C170CKT

D1 D2

11

2

CONN header VERT SGL, 3 POS, gold

generic

J4 J21

12

3

Jack banana mini PNL MT, 10 PC, red

generic

J13 J19 J26

13

3

Jack banana mini PNL MT, 10 PC, black

generic

J14 J20 J27

14

18

CONN header VERT SGL, 2POS, gold

3M

961102-6404-AR

J22 J24 J28 J29 J32 J34 J37 J38 J100 J101 J102 J103 J105 J106 J109 J110 J150 J160

15

1

CONN header 0.100 dual R/A 72POS

Sullins

PTC36DBAN

J500

16

1

USB micro-AB through hole

17

2

1.5 µH, Isat_min = 2.7 A, DCR_max = 95 m

18

2

RES .02 Ω, 0.1 W, 1%, 0603, SMD

generic

R10 R20

19

4

RES 47.0 ΩK, 1/16 W, 1%, 0402, SMD

generic

R100 R103 R200 R203

80-NH006-3 Rev. B

J600 Toko

L100 L200

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

43

SMB1360 Evaluation Board User Guide

Bill of Materials

Item number

Qty

20

8

RES 0.0 Ω, 1/16 W, 5%, 0402, SMD

generic

R101 R102 R105 R106 R201 R202 R205 R206

21

2

RES 10.0 ΩK, 1/16 W, 1%, 0402, SMD

generic

R104 R204

22

8

RES 2.00 ΩK, 1/16 W, 1%, 0402, SMD

generic

R107 R110 R111 R112 R207 R210 R211 R212

23

2

Thermistor NTC 10 ΩK, 1%, 0402

generic

R108 R208

24

4

RES 0 Ω, 1/16 W, 5%, 0402, SMD

generic

R109 R113 R209 R213

25

2

Switch dip low PRO 1 POS gold

KAJ01LAGT

SW100 SW200

26

58

Pin RCPT .025/.037 DIA 0300-1 SR

generic

TP100 - TP551

27

2

Term block header 3 POS R/A 3.5 mm

284512-3

U4 U5

80-NH006-3 Rev. B

Description

Vendor

E-switch TE connectivity

Vendor part number

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

Reference designator

44

8 USB Dongle and Cable

Micro Type B

Type A

Figure 8-1 USB A to micro B cable and connectors

10 pin header

Micro B

Figure 8-2 USB to I2C dongle

80-NH006-3 Rev. B

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION Confidential and Proprietary – Qualcomm Technologies, Inc.

45