MT6360 Design Notice (for MT6785) [1.0 ed.]

Citation preview

CONFIDENTIAL B

MT6360 Design Notice (for MT6785)

V1.0 2019/10/01

Revision V0.1

Date 2019/01/10

Author Ice Initial

History

Description

1. Update RGB supply current 1-channel with typo 2. Update charger current up to 3A. 3. Update description in “Charger: CHRDETB, VBUS OVP”. (VBUS>OVP: has INT to AP, and stop charging for protection (by CHG_VIN OVP=14.5V)) 4. Update description in “USB PD: Application”. (PD_VCONN5V connect to VSYS w/o diode) 1. Update charging current is programmable from 0.3A to 3A in “Charger: Constant Current”. 2. Update typo in “Charger: Safety Timer”. 3. Change “VPU” word to “APU”.

V0.2

2019/02/19

Ice

V0.3

2019/03/13

Ice

V0.4

2019/03/25

Ice

1. Update LDO5 (VMCH) layout constraint. (L1=7nH to 20nH)

V0.5

2019/05/15

Ice

1. Update “Update Figure for Chip Placement Recommendation ”

Ice

1. Remove OTG OC 3A. 2. Update VCHG_VIN OVP from 10.5V to 11V. 3. Update FAULTB block figure. 4. Update UVLO/HW trapping register address.

V0.6

2019/06/04

CONFIDENTIAL B

1

Revision

Date

Author

V0.7

2019/07/31

Ice

V1.0

2019/10/01

Ice

CONFIDENTIAL B

History

Description 1. Modify format about “Connection for Un-used Pin”. 2. Update un-used pin about “VREF_TS/TS” 3. Add “SDA Trace Layout Constraint” 4. Update LDO1/2/3/5 output voltage range in “MT6360 Buck/LDO Power Plan”. 5. Update LDO6 layout constraint in “MT6360 LDO Layout Constraint #1”. 1. Update to V1.0 without change

2

Content ▪ MT6360 Introduction ▪ Function Description ▪ PCB Layout Guideline

CONFIDENTIAL B

3

Block Interface Overview 3A Switching Charger

LDO * 6

Flash LED 2.5A/2-CH

MT6360

Buck *2

CONFIDENTIAL B

USB PD

RGB Driver 4 Channel

Schematic Overview

VBATS pin is Kelvin-sense trace which must be connect to battery connector

TVS for surge protection

PD_CC1/PD_CC2 =10mil

Put TVS for ESD protection if D+/D-, ID pin connect to USB connector

* I2C bus must be dedicated connection to AP for MT6360 USB_PD application, and I2C bus speed must be >1MHz

CONFIDENTIAL B

FL_LEDCS1 and FL_LEDCS2 trace wide must be base on flash current

5

Schematic Overview Detect the R on UVLO_SEL and HW_TRAPPING

LDO_VIN1 for LDO1/2/3 LDO_VIN2 for LDO5 LDO_VIN3 for LDO6/7

BUCK1 for APU

LDO1 for VFP BUCK1 /2 _VOUT & RSGND pin is Kelvin-sense trace

LDO2 for VTP LDO3 for VMC LDO5 for VMCH LDO6 for VMDDR

BUCK2 for VDRAM1

LDO7 for VDRAM2

Note: Even if LDO5 is no used, LDO_VIN2 MUST keep connect to VSYS power. CONFIDENTIAL B

Charger Feature List Feature list Charge Current Regulation Charge Voltage Regulation Average Input Current Regulation (AICR) Synchronous 1.5Mz/0.75MHz Fixed-Frequency PWM Thermal Regulation and Protection Over-Temperature Protection CHRDETB

USB OTG USB B.C. v.1.2 Detection CHG_VIN Over-Voltage Protection Threshold Integrated ADCs for System Monitoring Low Battery Protection for Boost Operation Charging Watchdog (reset to default) Charging Safety timer IRQ (interrupt function) MTK PumpExpress Charging CONFIDENTIAL B

Description ICC level: 0.5A~3A, 0.1A/step VBAT = 3.8V, ICHG > 1000mA(TC = 30°C to 65°C), Accuracy ±5% CV level: 3.9V~4.71V, 10mV/step VOREG_CHG = 4.2V, 4.35V, 4.36V, or VOREG_CHG = 4.38V , TC = 0°C to 70°C, Accuracy: ±0.5% AICR level: 0.1A/0.15A~3.25A, 50mA/step 1.5MHz(default) 0.75MHz/1MHz/1.5MHz selectable Controller with up to 95% Duty Cycle 120 ℃(default) 100 ℃/120 ℃ selectable Thermal shutdown threshold temperature = 150℃, Hysteresis=40℃ VBUS OVP High Threshold: 10.5V (default) VBUS OVP Range= 6.0V~14.5V. Hysteresis=150mV. VBUS UVLO High Threshold: 3.7V (default) VBUS UVLO Range= 2.6V~3.7V. Hysteresis=150mV. OTG output: 5.05V (default) OTG output voltage range: 4.425V~5.825V, 50mV/step. OTG OC: 1.3A (default) OTG OC: 0.5A/0.7A/1.1A/1.3A/1.8A/ 2.1A/2.4A. USB B.C. v1.2 charging port compliance 6.5V (default) VCHG_VIN rising, I2C programmable 5.5V/6.5V/11V/14.5V) ADC channel: VBUS_DIV5/VBUS_DIV2/VBAT/VSYS/IBUS/IBAT/TEMP_JC/USB_ID/TS_USB 2.8V falling (default) 2.8V/2.7V~3.8V, 0.1V/step. Watchdog time-out protection to stop charging IRQ pin support INT to AP Support MTK PumpExpress+1.1 and 2.0 by HW auto-control.

USB PD Feature List Feature list

Description

Dual-role PD compatible Attach/Detach detection as host, device or DRP Source mode: Voltage: 5V ±5% Current: 2A (max) Current capability definition and detection Sink mode: Voltage: 5V~14V ±5% Current: 3A (max) Cable recognition Get e-marked cable capabilities The USB Power Delivery Structured VDMs are defined Alternate mode support to extend the functionality a device exposes. VCONN input Over-Voltage Protection 6V 400mA (default) Supporting VCONN with programmable OCP VCONN level: 200mA~800mA, 100mA/step Dead battery support CC always is RD mode when dead battery BMC BIST mode supported BMC Built in Self-Test Supported PD 3.0 Support Universal Serial Bus Power Delivery Specification 3.0 USB PD Power role Support

CONFIDENTIAL B

Flash LED Driver Feature List Feature list Synchronous Boost Dual Flash LED Driver with Dual Independently-Programmable LED Current Sources I2C-Programmable Flash Safety Timer Flash LED1/LED2 Short-Circuit Protection, and Output Short-Circuit Protection TX Mask Protection with dedicated FL_TXMASK Pin Shared Charger/OTG as Power Stage Support Auto-Tracking Mode Independent Torch Bypass MOSFET from VSYS Torch Mode Current Strobe Mode Current

CONFIDENTIAL B

Description The max strobe current of each channel = 1.5A The total max strobe current of 2-CH = 2.5A FLED strobe timeout: 64ms~2432ms, 32ms/step LEDCS Short protection threshold < 1V, delay time = 2.5ms TX_ActiveLevel=H (default) TX_ActiveLevel=L / TX_ActiveLevel=H selectable All FLEDs' TX function disable (default) Can select only LEDCS1 or LEDCS2 or both LEDCS1 & LEDCS2 be enabled TXMASK function Can save one inductor cost by use the same boost circuit of OTG mode Fix mode (default) MID Regulation Level by Fix mode/MID Regulation Level by auto-tracking selectable Can gain more efficiency by Auto-Tracking Mode TA can also support Torch current Torch mode current level: 25mA~400mA, 12.5mA/step ULTRA LOW ISTRB=0 Strobe mode current level: 50mA~1500mA, 12.5mA/step ULTRA LOW ISTRB=1 Strobe mode current level: 25mA~750mA, 6.25mA/step

RGB Indicator Feature List Feature list

Description RGB_ISINK1~3 can support Register mode, PWM mode and Breath mode 3-Channel LED Driver RGB_ISINK1 for CHG_VIN Power Good Indicator AUTO mode(default)/ Software mode selectable Default :8mA Sink Current for 3 RGB LEDs 1mA~24mA, 2mA/step Default :0.2Hz FLASH Dimming Frequency PWM Frequency: 0.125Hz/0.25Hz/0.5Hz/1Hz/2Hz/4Hz/128Hz/256KHz All 3 channels : 203uA RGB Supply Current 2-channels : 162uA 1-channel : 122uA Programmable breathe mode by set Tr1, Tr2, Tf1, Tf2, TON, TOFF Breath Mode parameters ML_ISINK for Moonlight Mode LED Current support up to 150mA, step=5mA

CONFIDENTIAL B

MT6360 Buck/LDO Power Plan Circuit Type

Name

Buck

BUCK1 (APU) BUCK2 (VDRAM1)

Output Voltage Range (V) 0.3 ~ 1.3 (5mV/step) 0.3 ~ 1.3 (5mV/step)

Name

Output Voltage (V)

Circuit Type

LDO1 LDO2

1.8/2.0/2.1/2.5/2.7/ 2.8/2.9/3.0/3.1/3.3 1.8/2.0/2.1/2.5/2.7/ 2.8/2.9/3.0/3.1/3.3

Boot Default (V)

IOUT-MAX (mA)

Expected use

ON (0.825)

3000

SoC APU

ON (1.125)

3000

DDR

Boot Default (V)

IOUT-MAX (mA)

Expected use

OFF (1.8)

150

Fingerprint

OFF (1.8)

200

Touch Panel

LDO3

1.8/2.9/3.0/3.3

OFF (3.0)

200

SD Card

LDO5

2.9/3.0/3.3

OFF (3.0)

800

SD Card

LDO6

0.75

ON (0.75)

300

EMI_VMDDR

LDO7

0.6

ON (0.6)

600

EMI_VDDQ

LDO

CONFIDENTIAL B

11

Content ▪ MT6360 Introduction ▪ Function Description • • • • • • • •

General Charger Flash LED Driver RGB Buck LDO USB PD Rust Protection

▪ PCB Layout Guideline CONFIDENTIAL B

12

Normal Power-ON/OFF Sequence VSYS =VDDA =VBAT EN BUCK1 VPU BUCK2 VDRAM1 LDO6 VMDDR

100KΩ)

CHG_QONB Long Press Shutdown Power Path disconnect

CHG_QONB pin

T1=15S

VSYS REG RST (internal signal)

CONFIDENTIAL B

T2=0.66S

Reset register

18

FAULTB   

FAULTB pin indicated power good of BUCK1/2 and LDOs. It’s open-drain output to indicate power fault. If MT6360’s FAULTB=L  MT6359 CAN’T send RESETB=H to AP.

CONFIDENTIAL B

19

I2C Safe Timer  

When system freeze and charger be disabled. Battery will keep consumption and become to dead battery. To prevent this situation. The MT6360 also provide I2C Safe Timer function which can be enabled by set 0x01 (Bit7) and set safe timer deglitch time by 0x01 (bit 6 5).

Description 0x01[7] I2CSTMR_RST_EN=0 Disable safe timer (default) I2CSTMR_RST_EN=1 Enable safe timer

CONFIDENTIAL B

Copyright © MediaTek Inc. All rights reserved.

20

T

DP/DM Y-connection  

For USB B.C. v1.2 detection, Bead & 200R MUST be on Y-connection trace to MT6360. USB Bead Selection spec.: (Rated current>100mA) connector Frequency

Impedance

100MHz

≥1000 Ω

240MHz

≥1200 Ω

AP DM

DM

DP

DP Bead

1GHz



Bead

DM

≥2000 Ω

DP 200R

Bead example: Vender

CONFIDENTIAL B

1800Ω ±25%

2700Ω ±40%

MT6360

200R

P/N

Impedance(Ω) 100MHz

1GHz

muRata

BLM03HG122SN1

1200Ω ±25%

2000Ω ±40%

muRata

BLM03HD102SN1

1000Ω ±25%

2300Ω ±40%

muRata

BLM15HD102SN1

1000Ω ±25%

2000Ω ±40%

muRata

BLM15HD182SN1

1800Ω ±25%

2700Ω ±40%

TDK

MMZ0603A102ET000

1000Ω ±25%

2300Ω ±40%

TDK

MMZ1005A152ET000

1500Ω ±25%

2300Ω ±40%

TDK

MMZ1005A182ET000

1800Ω ±25%

2700Ω ±40%

TDK

MMZ1005A222ET000

2200Ω ±25%

3000Ω ±40%

Taiyo

BKH0603LM152-T

1500Ω ±25%

2700Ω ±40%

Taiyo

BKH1005LM152-T

1500Ω ±25%

2300Ω ±40%

Copyright © MediaTek Inc. All rights reserved.

21

Power Domain for I/O MT6360 Pin Name HW_TRAPPING CHRQONB MRSTB CHG_ENB

VDDA CHRQONB DVDD18_IO (SoC) DVDD18_IO (SoC)

Power Source Domain VDDA Internal Power VIO18 VIO18

EN

EXT_PMIC_EN1 (MT6359)

VSYS

3.1V ~ 5.0V

CHRDETB FAULTB WDTRSTB_IN SRCLKEN_0 SDCARD_DET_N CHG_VBATOVPB IRQB PD_IRQB

VSYS VSYS DVDD18_IO (SoC) DVDD18_IO (SoC) DVDD18_IO (SoC) VBAT DVDD18_IO (SoC) DVDD18_IO (SoC)

VSYS VSYS VIO18 VIO18 VIO18 VBAT VIO18 VIO18

3.1V ~ 5.0V 3.1V ~ 5.0V 1.8V 1.8V 1.8V 3.1V ~ 5.0V 1.8V 1.8V

CONFIDENTIAL B

Power Source Ball Name

Power Source Voltage 3.1V ~ 5.0V 1.8V 1.8V 1.8V

22

I2C Slaved Address ▪ There are four ID address of MT6360. ▪ The following table show the MT6360 unique address as PMU, PMIC, LDO or PD slave to AP.

CONFIDENTIAL B

Copyright © MediaTek Inc. All rights reserved.

2019/10/1

23

SDA Trace Layout Constraint ▪ If SDA trace distance > 1001 mil, suggestion to add a Rs on this trace.

SDA Trace (4mil, 1/3oz+plating)

CONFIDENTIAL B

PCB Trace Distance (Between AP and MT6360)

PCB L (Trace inductance)

Rs Value

≦ 1000 mil

≦ 12 nH

0 ohm

> 1001 mil

> 12.1nH

39 ohm

Copyright © MediaTek Inc. All rights reserved.

2019/10/1

24

Content ▪ MT6360 Introduction ▪ Function Description • • • • • • • •

General Charger Flash LED Driver RGB Buck LDO USB PD Rust Protection

▪ PCB Layout Guideline CONFIDENTIAL B

25

Charging Profile

 There are 5 intervals for total charging 1. 2. 3.

It depends on battery voltage level to change charging state It includes trickle charge when VBAT is over discharged MT6360 features IR compensation(Resistance compensation from charger to battery connector) and Termination in constant voltage mode

VBAT (Comp) IBAT

IBAT

VBAT IBAT (Comp) VBAT

Time Charging State

Trickle Charge

Pre-charge

CONFIDENTIAL B

Fast-charge (Constant current)

Fast-charge (Constant Voltage)

Termination

Re-Charge

26

Charger: Trickle Charge  Trickle charge 1. 2.

VBAT < 2V, the charging current will change to 100mA automatically. The trickle charge current and voltage level are can not be programmable.

CONFIDENTIAL B

27

Charger: Pre-Charge  Pre-Charge 1. 2.

When VPREC (default=3V) > VBAT > 2V, the charging current will increase to pre-charge current (default = 150mA) level which set by register. For system boot up consideration, VSYS will be regulated by system minimum level (default = 3.6V) which can be programmed by I2C

CONFIDENTIAL B

28

Charger: Constant Current  Fast Charge 1. 2.

After VBAT > VPREC (default = 3V), the charging current will decided by main charging factor. The charging current is programmable from 0.3 to 3A. (default = 2A)

CONFIDENTIAL B

29

Charger: Constant Voltage  Fast Charge 3. 4.

After VBAT >= VOREG (default = 4.2V), the charging current will decreased The user can select enable IR compensation or not. (default = 0m ohm)

CONFIDENTIAL B

30

Charger: Termination  Termination 1.

When charging current < IEOC level (default = 250mA), after during deglitch time (default = 2ms), the MT6360 will send IEOC IRQ.

CONFIDENTIAL B

31

Charger: Termination  Termination 1. 2. 3.

After IEOC IRQ occurs, the charger behavior decided by I2C bit TE (default = disabled) If TE = 1, charger will stop charging battery If TE = 0, charger will keep charging battery

CONFIDENTIAL B

32

Charger: Re-Charge  Re Charge 1. 2.

Once if VBAT is lower than VOREG – VREC (default = 100mV), the MT6360 will start to charging battery Charging behavior is back to constant current state

CONFIDENTIAL B

33

Analog IR Drop Compensation

▪ IR Compensation 1. 2. 3. 4.

Compensate the resistance of MT6360 to battery connector path The IR compensation can speed up the total charging time In order to protect battery, MT6360 features Battery OVP function. OVP level is decided by VOREG*108% After trigger BATOVP, charger will stop charging battery but power path keeps turn on for system loading. VBAT (Comp)

IBAT

IBAT

VBAT IBAT (Comp) VBAT

CONFIDENTIAL B

34

Time

Analog IR Drop Compensation

▪ IR Compensation 1. 2. 3.

The compensate voltage is decided by minimum of (VCLAMP & Charging Current x BAT_COMP) VCLAMP (default = 0mV), BAT_COMP (default = 0m ohm) CHG_VBATOVPB Pin (Open-drain) Low : Event occurs, High : No operation

CONFIDENTIAL B

35

Charger: Enable Bits  There are 3 enable bits, related to the charger. 1.CFO_EN (default = Enable) :  This bit is used to enable or disable the buck and boost of charger.  Note: When disable CFO_EN, the power path still be turned-on. Buck be turned-off

2.CHG_EN (default = Enable) :  When CHG_EN = Disabled • • • •

Zero charging current System loading provided by input source. Note: power path be turned-off Once if ISYS > IIN, battery will provide system loading to prevent VSYS voltage drop.

 The CHG_EN bit function is the same as CHG_ENB pin.

3.Hi-Z (default = Disabled) :  Turn off most of the charger internal circuits.  Cable plug-in will exit Hi-Z mode.

CONFIDENTIAL B

36

MIVR(Minimum Input Voltage Regulation) ▪ MIVR function is to avoid VBUS voltage collapse to UVLO. ▪ Default is 4.4V and can be set as 3.9V~13.4V per 0.1V.

CONFIDENTIAL B

37

AICR(Average Input Current Regulation) ▪ Default is 500mA and can be set as 100mA~3.25A per 50mA. ▪ Auto set the AICR level of current pattern when enable PE+1.1 and PE+2.0 communication

CONFIDENTIAL B

38

Charger: Input Current Limit Setting  In fast-charge mode, the input current limit can be selected by IINLMTSEL .  The actual input current limit is decided by the lowest one of IINLMTSEL and CHG_ILIM pin current limit. Addr

RegName

Bit

BitName

0x12 CHG_CTRL2 3:2 IINLMTSEL[1:0]

CONFIDENTIAL B

Default

00

Description Input current limit selection bit 00 : AICR=3.25A (default) 01 : CHG_TYP results is applied 10 : IAICR[5:0] results is applied 11 : Input limit is set by the lower level of these three

39

Charger: GHG_ILIM PIN Setting  For hardware protection, the PMIC supports input current limit on CHG_ILIM pin which set by a resistor (R2) from CHG_ILIM pin to ground.  Formula : IIN,MAX = KILIM / RILIM Parameter Symbol Input Current Limit KILIM_CHG Factor

Test Conditions Input current regulation by CHG_ILIM pin = 0.5A

MIN

TYP MAX Unit

320

355

390

AΩ

CHG_ILIM R2

CONFIDENTIAL B

40

Charger: Watchdog  The host has to reset the watchdog timer by writing or reading by I2C periodically  When the watchdog timer is expired, IC will set Register as below: • • • •

(1)CFO_EN disable (2)CHG_EN disable (3)Return to charge mode (Exit OTG mode, and reset entry method of OTG ) (4)Enable safety timer

Address

Bit 7

Bit Name CHG_WDT_EN

6 CHG_WDT_TRST 0x1D

5:4

CHG_WDT

CONFIDENTIAL B

Description Charger Watch dog timer enable/disable 0 : Disable(default) 1 : Enable Waiting timer to set Register after watchdog is asserted 0 : 200ms 1 : 500ms(default) Watch dog timer, from WDTEN is enabled to watchdog IRQ 00 : 8s 01 : 40s(default) 10 : 80s 11 : 160s

41

Charger: Thermal Regulation Setting ▪ MT6360 has 2-levels for thermal regulation setting - THREG: 100°C, 120°C. ▪ When MT6360 reach thermal regulation setting, it will start to decrease charging current and send TREG IRQ.

ICC

120℃

CONFIDENTIAL B

42

Charger: CHRDETB ▪ MT6360 CHRDETB pin connect to MT6359. ▪ It’s open drain output to indicate VBUS plug in/out TYPE-C connector

PD_VCONN5V PD_CC1 PD_VBUS CHG_QONB PD_CC2

PWRKEY

CHRDETB

CHRDETB

VSYS 100Kohm

(open-drain)

MT6359

EXT_PMIC_EN1

EN

MT6360

IRQB

AP

AP

MRSTB

AP

AP

PG CHG_VLX

RESETB WDTRSTB EXT_PMIC_PG

VSYS

VSYS

BATFET

VBAT

CONFIDENTIAL B

43

Charger: CHRDETB ▪ Detect VBUS and CC1/CC2 state for MT6359 power-on conditions ▪ MT6360 must pull-low CHRDETB @UVLO FLEDX_TCL Strobe timeout starts counting

FL_STROBE Current Level (FLEDX_ISTRB) Current Level (FLEDX_TCL) 3.6ms

FL_LEDCS# (Current)

FLED_STRB_TO

FLED_STRB_TO

3.6ms

FLEDX_ISTRB < FLEDX_TCL Strobe timeout does not count

 Strobe Mode, timeout counts when FLED_ISTRB setting is higher than FLED_TCL.  Strobe Mode, timeout does not count when FLED_ISTRB setting is lower than FLED_TCL. It backs to timeout counting after FLED_ISTRB setting is higher than FLED_TCL.

CONFIDENTIAL B

61

FLED: GPIO Control

Reg0x70[1] FLED_STRB_LES

▪ Level sensitive FL_STROBE



FLED turns on when FLEDCSX_EN and FL_STROBE=1



FLED turns on when FLEDCSX_EN=1 with FL_STROBE rising edge

FLCS1_EN (REG0x7E[1]) FLCS2_EN (REG0x7E[0]) FL_LEDCS1 (Current)

3.6ms

310us

FL_LEDCS2 (Current)

3.6ms FLED_STRB_TO

310us

FLED_STRB_TO

▪ Rising edge trigger FL_STROBE

10us

FLCS1_EN (REG0x7E[1]) FLCS2_EN (REG0x7E[0]) FL_LEDCS1 (Current)

3.6ms

3.6ms FLED_STRB_TO

FL_LEDCS2 (Current)

FLED_STRB_TO

FLED_STRB_TO

FL_LEDCS2 does not turn on without FL_STROBE risng edge trigger

CONFIDENTIAL B

FL_LEDCS1/2 turns on with FL_STROBE risng edge trigger

62

FLED: GPIO Control

▪ Level sensitive

Reg0x70[1] FLED_STRB_LES

FL_STROBE



FLED turns on when FLEDCSX_EN and FL_STROBE=1



FLED turns on when FLEDCSX_EN=1 with FL_STROBE rising edge

FLCS1_EN (REG0x7E[1]) FLCS2_EN (REG0x7E[0]) FL_LEDCS1 (Current)

310us

3.6ms

FLED_STRB_TO

FLED_STRB_TO

FL_LEDCS2 (Current)

FLED_STRB_TO

FLED_STRB_TO

FL_LEDCS2 turns on when FL_STROBE is high level

▪ Rising edge trigger FL_STROBE FLCS1_EN (REG0x7E[1]) FLCS2_EN (REG0x7E[0]) FL_LEDCS1 (Current)

310us

3.6ms FLED_STRB_TO

FL_LEDCS2 (Current)

FLED_STRB_TO

FLED_STRB_TO

FL_LEDCS2 does not turn on without FL_STROBE risng edge trigger CONFIDENTIAL B

FL_LEDCS2 turns on with FL_STROBE risng edge trigger 63

FLED: Supply Limitation High CHG_VIN Voltage

▪ CHG_VIN over voltage for Strobe function supply limit • Strobe function is inactivated when CHG_VIN voltage is higher than 5.6V • Strobe function is available when CHG_VIN over voltage condition is removed.

Parameter

Min

Typ.

Max

Units

CHG_VIN OVP Level VIN_OVP_FL

5.45

5.6

5.75

V

Hysteresis VIN_OVP_Hys_FL

0.23

0.3

0.37

V

CONFIDENTIAL B

64

FLED: Short Protection ▪ FL_LEDCSX voltage for FLED short detection • • • •

Short condition detected if voltage of FL_LEDCSX is below 1V.(typ.) Output current limited to startup current level(320uA). Interrupt after short condition 2.5ms.(typ.) FLED auto-recovery when short condition is removed.

Parameter Short Detection Level V_SC_FL Presence Detection Time TD_SC_FL

CONFIDENTIAL B

Min

Typ.

Max

Units

-

1

1.3

V

1.8

2.5

3.3

ms

65

FLED: Application

Operation with Adapter Plug-IN/OUT Torch_en5VTAIn 5VTAOutTorch_dis

Strobe_en5VTAIn 5VTAOutStrobe_dis

Torch_enHVTAIn HVTAOutTorch_dis

Strobe_enHVTAIn HVTAOutStrobe_dis

Torch_en5VTAIn Torch_dis5VTAOut

Strobe_en5VTAIn Strobe_dis5VTAOut

Torch_enHVTAIn Torch_disHVTAOut

Strobe_enHVTAIn Strobe_disHVTAOut

Note. HVTA with charger voltage ≧5.6V CONFIDENTIAL B

66

FLED: Application

Operation with Adapter Plug-IN/OUT 5VTAInTorch_en 5VTAOutTorch_dis

5VTAInStrobe_en 5VTAOutStrobe_dis

HVTAInTorch_en HVTAOutTorch_dis

HVTAInStrobe_en HVTAOutStrobe_dis

5VTAInTorch_en Torch_dis5VTAOut

5VTAInStrobe_en Strobe_dis5VTAOut

HVTAInTorch_en Torch_disHVTAOut

HVTAInStrobe_en Strobe_disHVTAOut

Note. HVTA with charger voltage ≧5.6V CONFIDENTIAL B

67

FLED: Application Operation with OTG

Torch_enOTGOn OTGOffTorch_dis

Strobe_enOTGOn OTGOffStrobe_dis

Torch_enOTGOn Torch_disOTGOff

Strobe_enOTGOn Strobe_disOTGOff

OTGOnTorch_en OTGOffTorch_dis

OTGOnStrobe_en OTGOffStrobe_dis

OTGOnTorch_en Torch_disOTGff

OTGOnStrobe_en Strobe_disOTGff

CONFIDENTIAL B

68

Content ▪ MT6360 Introduction ▪ Function Description • • • • • • • •

General Charger Flash LED Driver RGB Buck LDO USB PD Rust Protection

▪ PCB Layout Guideline CONFIDENTIAL B

69

RGB: Application Circuit  It is a three-channel LED driver designed to produce variety of lighting effects for mobile device. The device is gradually increase or decrease the brightness of the backlight LED upon command by I2C control, and it also can support RGB mode to select PWM mode, Breath mode and Register mode.  The RGB_ISINK1 default setting is auto mode that using for TA charging indicator, It also support to software mode.  For the RGB application, user must consider the LED forward voltage, the MT6360 RGB current sink headroom and the minimum battery application voltage to make sure the output current accuracy.

Note: To do RGB register setting before enable.

CONFIDENTIAL B

70

RGB: PWM Mode  The MT6360 features a built-in PWM mode control by setting ISINKx_DIM_MODE to 00. The RGB_ISINK1~RGB_ISINK3 of the MT6360 can provide up to 24 mA per string. There are 13 step LED current control by setting ISINKx_CUR_SEL each channel. The ON/OFF of the current source is synchronized to the PWM signal. The frequency of LED current is equal to the PWM input signal that is setting by ISINKx_DIM_FSEL. In order to guarantee the PWM resolution, the PWM frequency have to be operated at range of 0.1Hz to 256Hz that is selected by ISINKx_DIM_FSEL.

…

24 mA 4 mA 2 mA 1 mA 0 mA

Current Time Frequency

Note: LED Current Level 0000 = 1 mA 0001 = 2 mA 0010 = 4 mA 0011 = 6 mA … 1010 = 20 mA (default) ... 1100 = 24 mA … 1111 = 24 mA

Duty 256 steps CONFIDENTIAL B

71

RGB: Breath Mode  In the breath mode, the 3 channels of the MT6360 can provide up to 24 mA per string. There are 13 step LED current control by setting register ISINKx_CUR_SEL each channel.  In order to provide a smooth breath mode, there are 6 period timing to control the rising time and falling time, and it is control by setting register ISINKx_VREATH_TON_SEL, ISINKx_BREATH_TOFF_SEL, ISINKx_BREATH_Trx_SEL and ISINKx_BREATH_Tfx_SEL.  In breath mode, the sink current work like PWM output with 256Hz and control the duty to similar the breath up and down. The human’s eyes do filter the PWM current the frequency that higher than 100Hz. …

24 mA

IRGB

4 mA 2 mA 1 mA 0 mA

Time TOFF

Tr1

Tr2

TON

Tf1

Tf2

…

24 mA

IRGB (After eyes filter)

Note: The IRGB of point A & B is 30% of Current level CONFIDENTIAL B

4 mA 2 mA 1 mA 0 mA

Current A

B

Time TOFF

Tr1

Tr2

TON

Tf1

Note: LED Current Level 0000 = 1 mA 0001 = 2 mA 0010 = 4 mA 0011 = 6 mA … 1010 = 20 mA (default) ... 1100 = 24 mA … 1111 = 24 mA

Tf2 72

RGB: Register Mode  The MT6360 features a built-in register mode control by setting ISINKx_DIM_MODE to 1X. The three channels of the MT6360 can provide up to 24 mA per string. There are 13 step LED current control by setting register ISINKx_CUR_SEL each channel.

…

24 mA 4 mA 2 mA 1 mA 0 mA

CONFIDENTIAL B

Current Time

Note: LED Current Level 0000 = 1 mA 0001 = 2 mA 0010 = 4 mA 0011 = 6 mA … 1010 = 20 mA (default) ... 1100 = 24 mA … 1111 = 24 mA

73

Moon-Light: Application Circuit  The ML_ISINK can provide the 150mA for the moonlight photo mode. There is only register mode with the soft-start control.  For the ML application, user must consider the LED forward voltage, the MT6360 ML current sink headroom and the minimum battery application voltage to make sure the output current accuracy.

Note: To do ML register setting before enable.

CONFIDENTIAL B

74

Moon-Light Mode  To check the LED VF behavior. • Operation VBAT/VSYS range:  VBAT > LED_VF + Current Sink Dropout.  Constrain: > Customized Battery Volume

• LED current range: Imax=~150mA, 5mA/step

150 mA

Current 0 mA

Time SS 16 steps 15us/step

CONFIDENTIAL B

75

Content ▪ MT6360 Introduction ▪ Function Description • • • • • • • •

General Charger Flash LED Driver RGB Buck LDO USB PD Rust Protection

▪ PCB Layout Guideline CONFIDENTIAL B

76

Schematic/Layout Notice

Buck Converter Input/Output Decoupling

BUCK BUCK1 (APU) BUCK2 (VDRAM1)

CONFIDENTIAL B

Input Decoupling

Output Decoupling

≥ 4.7uF/0402/6.3V/X5R

0.33uH/2016

22uF/0603/6.3V/X5R *(2~3)

≥ 4.7uF/0402/6.3V/X5R

0.33uH/2016

22uF/0603/6.3V/X5R *(2~3)

77

Schematic/Layout Notice Buck Converter Output Decoupling

Buck

COUT (typical value)

PDN Cap (typical value)

Total COUT Value (after derating)

BUCK1 (APU)

22uF/0603/6.3V/X5R *2

1uF/0201/6.3V/X5R *4

≥ 20.6uF

#1

BUCK2 (VDRAM1)

22uF/0603/6.3V/X5R *2

4.7uF/0402/6.3V/X5R *2 1uF/0201/6.3V/X5R *8

≥ 20.6uF

#1

Note #1: Total COUT Value @ 1V derating for AC 0.01Vrms and overall operating temperature.

CONFIDENTIAL B

Schematic/Layout Notice Buck Input Cap. Layout Spec.

▪ MMD spec  The spec of trace parasitic inductance from buck input cap to PMIC Ball ▪ (L_PWR1+L_GND1) < Spec L_PWR1

VSYS

PMIC VSYS_BUCK

CIN 1

GND_BUCK L_GND1

BUCK input cap to IC ball layout inductor value constraint Regulator BUCK1 BUCK2

Input Trace (from Caps to IC ball) BUCK1_PVIN BUCK1_PGND BUCK2_PVIN BUCK2_PGND

CONFIDENTIAL B

Inductance

Application

(L_PWR1 + L_GND1) < 1.5nH

APU

(L_PWR1 + L_GND1) < 1.5nH

VDRAM1

79

Schematic/Layout Notice Layout Guide #1

▪

Place power inductors as close to PMIC balls as possible and put in shield case.

▪

BUCKx_VOUT & BUCKx_RSGND layout should follow PCB layout constraint.

▪

Inductance need to follow application notice that has components selection guide.

▪

Placement, layout and schematic need to follow checklist.

Buck input cap detail layout rule, please refer to next page. CONFIDENTIAL B

Schematic/Layout Notice Layout Guide #2

▪

Inductance need to follow application notice that has components selection guide.

▪

Placement, layout and schematic need to follow checklist.

Example 1 PMIC Buck GND ball

Example 2

Input Cap GND pad

PMIC Buck GND ball

Layer-1

Input Cap GND pad

Layer-1 GND return path

Layer-2

Layer-2 Solution 2

Solution 1

GND return path

Layer-3

Layer-3

Layer-5

Layer-5

Main-GND Layer

Main-GND Layer

CONFIDENTIAL B

Solution 2

Solution 1

Schematic/Layout Notice Layout Guide #3

CONFIDENTIAL B

82

Schematic/Layout Notice

Layout Guide #4: Remote Sense Application ▪

DC/DC remote sense feedback & feedback_GND traces are recommended using GND shielding and differential pair to avoid noise coupled.

CONFIDENTIAL B

83

Schematic/Layout Notice

Layout Guide #5: Remote Sense Application Cout1

Rc1

L1

L4 Remote pt.1 R_remote spec Cout2 (Follow MMD SPEC)

Lout Rc2

PMIC

SOC

L2 L3

Cout3

Rc3 1. 2.

Find path with lowest inductance, the remote point can be located within Coutlowest L + 1n. For example, in case of Cout1 is path with lowest inductance. • Inductance between Cout1 and Remote pt. 1 is L4, L4 must be lower than 1n (L4 < 1n). • The remote point location can be between Cout1 and Remote pt. 1. 3. Same case apply to L2 & L3 if they are lowest inductance path. 4. Above case is for multi-path, in case of single path, consider the only path as the lowest inductance path directly. CONFIDENTIAL B

84

Schematic/Layout Notice

Layout Guide 6/6: Remote Sense Application BUCKx_VOUT LX

Domain PDN Cap.

SOC

Cap. Layer via Ln

via

+ -

Bulk Cap.

Plane Main GND trace

For GND/VOUT of PDN/Bulk cap. pads, please tie together through Plane before connected to Main GND BUCKx_RSGND/BUCKx_VOUT(Fully differentially connected) trace routes directly to a via underneath PDN cap. pads, which also satisfies “Remote Sense Application Notice : Layout Guide (2)” CONFIDENTIAL B

BUCKx_RSGND

Schematic/Layout Notice

Buck Converter Input/Output Layout Trace Width ▪

▪

Place input cap. as close to PMICs as possible Input net name

Trace Width (mils)

BUCK1_PVIN

30

BUCK2_PVIN

30

Place output cap. as close to application side as possible Output net name BUCK1 (APU) BUCK2 (VDRAM1)

CONFIDENTIAL B

Trace Width (mils) 50 75

Critical Component Selection Guide Power Inductor #1

•

Inductors are recommended to follow below notice. 1. Rate current of the inductor should be follow bellow table: (Inductance change within ±30% from nominal value). 2. Although small size and high efficiency are major concerns, the inductor should have low core losses and low DCR (copper wire resistance). Efficiency data in MT6360 datasheet is based on 30mΩ DCR.

BUCK

Inductance (uH)

ISAT,MAX (A)

ITEMP, MAX (A)

APU

0.33

3.1

2.1

VDRAM1

0.33

4.0

3.0

CONFIDENTIAL B

87

Critical Component Selection Guide Power Inductor #2

Example:

L =>30%

Note: 1. The inductor saturation current with 30% decreasing “must be” higher than PMIC Imax for all operation condition.

CONFIDENTIAL B

88

Content ▪ MT6360 Introduction ▪ Function Description • • • • • • • •

General Charger Flash LED Driver RGB Buck LDO USB PD Rust Protection

▪ PCB Layout Guideline CONFIDENTIAL B

89

MT6360 LDO Placement Rule ▪ If LDO is “default off” and loading current is 0mA, output capacitor can be removed. ▪ If VDRAM2 current rating is lower than 0.1mA, min capacitor can be reduced to 1uF.

CONFIDENTIAL B

90

MT6360 LDO Input Capacitor

Input Capacitor Typical Vale LDO_VIN1 LDO_VIN2 LDO_VIN3

2.2uF/0402/6.3V/X5R 2.2uF/0402/6.3V/X5R 2.2uF/0402/6.3V/X5R

Total CIN Value (after derating) ≥ 0.49uF #1 ≥ 0.49uF #1 ≥ 0.49uF #1

Note #1: Total CIN Value @ 5V derating for AC 0.01Vrms and overall operating temperature.

CONFIDENTIAL B

MT6360 LDO Output Capacitor Range Input Source LDO_VIN1 LDO_VIN1 LDO_VIN1 LDO_VIN2 LDO_VIN3 LDO_VIN2 LDO_VIN3 LDO_VIN2

LDO LDO1 LDO2 LDO3 LDO5

LDO Application VFP VTP VMC VMCH

Cout Range 1uF ~ 10uF 1uF ~ 10uF 1uF ~ 6uF 4.7uF ~ 10uF

LDO6

EMI_VMDDR

36uF ~ 46uF

LDO7

EMI_VDDQ Ext. EN

20uF ~ 54uF 1uF

Note: Even if LDO5 is no used, LDO_VIN2 MUST keep connect to VSYS power.

CONFIDENTIAL B

92

MT6360 LDO Layout Constraint #1 LDO Layout Constraint for Stability LDO LDO1 (VFP) LDO2 (VTP) LDO3 (VMC) LDO5 (VMCH) LDO6 (VMDDR) LDO7 (VDRAM) LDO7 (GPIO_EN)

L1 ≤

R1≤

C1 Minimum

(L1+L2)≤

(R1+R2)≤

C2 Maximum

Maximum Cap

20nH

0.2Ω

1uF

40nH

0.6Ω

9uF

10uF

20nH

0.2Ω

1uF

40nH

0.6Ω

9uF

10uF

20nH

0.2Ω

1uF

40nH

0.6Ω

5uF

6uF

20nH

0.2Ω

1uF

40nH

0.6Ω

9uF

10uF

7nH

0.033Ω

10uF

27nH

0.033Ω

36uF

46uF

7nH

0.016Ω

20uF

7nH

0.016Ω

34uF

54uF

20nH

0.2Ω

1uF

20nH

0.2Ω

-

1uF

PMIC L1

R1

L2

R2

LDO

Application C1

CONFIDENTIAL B

C2

Note: For L1 ≤ 7nF LDO, near-end Cap C1 is must and close to PMIC. Take VIO18 as example: Near-end cap is must; VIO18’s inductive reactance should within 27nH, impedance within 0.52Ω. 93

MT6360 LDO Layout Constraint #2 ▪ Multi-application Notice • Typical cap please refer design notice • DC spec is no included PCB DC drop • Each trace width > 6mil

▪ Below LDOs can’t follow this common rule • VDRAM, VMDDR, VMCH Application #1 PMIC

L1 ≤7nH

R1 ≤0.2Ω

L21 ≤20nH

R21 ≤0.2Ω

LDO

Application #2 C1 (typ)

C21 ≤1xC1

L22 ≤40nH

R22 ≤0.4Ω Application #3

(C1(typ)+C21+C22) ≤ C1(max)

CONFIDENTIAL B

C22 ≤0.5xC1

94

MT6360 LDO Layout Constraint #3 Rough Guidelines-use from CAD Extraction w (mil) 4

w (um) 101.6

h (um) 50

t @ 1/3 oz (um) 12

L (nH) = 4.85 nH ×

len (cm) 1.27

trace inductance (nH) 4.85

trace resistance (mΩ) 198

101.6 um len h × × w 1.27 cm 50um

101.6 um len R (mΩ) = 198 mΩ × × w 1.27 cm

where w = 4mil~40mil

Parameter Dielectrically constant Conductivity

CONFIDENTIAL B

Value 4.0 5.8e7 s/m

w = trace width len = trace length t = trace thickness h = dielectric height 95

LDO5 (VMCH) Disable by HW ▪ Function Description • SDCARD_DET_N to check the EINT_SD • SDCARD_DET_N could control VMCH and configure as High/ Low active by register • All function default off and controlled by “PMIC init setting”

▪ Spec • • • •

Reaction timing< 10us Pull-Down Ability on SDCARD_DET_N= 1uA SD card from plug out to VMCH= 1.8V < 0.3ms SD card from plug out to VMCH off < 1.5ms 10us VMCH

VMCH < 1.8V VMCH < 0.1V 0.3ms

SDCARD_DET_N 1.5ms

CONFIDENTIAL B

96

Content ▪ MT6360 Introduction ▪ Function Description • • • • • • • •

General Charger Flash LED Driver RGB Buck LDO USB PD Rust Protection

▪ PCB Layout Guideline CONFIDENTIAL B

97

USB PD Content USB PD function of MT6360 follows USB Type-C Port Controller Interface spec 1.0, IC operating mode according to the specification P16~P18. We can download spec on USB official website. http://www.usb.org/developers/docs/ Some “Not support” functions are listed in the register table. The following functions are not standard functions defined in TCPC spec. 1. 2. 3. 4.

PD Watch Dog Function PD I2C Reset Function PD Power Mode PD application

CONFIDENTIAL B

98

USB PD: Application Part

Function portfolio

PD

Unused Type-C Unused PD (Unused E-marked)

PD

Use Type-C Unused PD (Unused E-marked)

PD

Use Type-C Use PD (Use E-marked)

PD

Use Type-C Use PD (Unused E-marked)

CONFIDENTIAL B

Pin Name PD_VBUS PD_CC1 PD_CC2 PD_VCONN5V PD_IRQB PD_VBUS PD_CC1 PD_CC2 PD_VCONN5V PD_IRQB PD_VBUS CC1 CC2 PD_VCONN5V PD_IRQB PD_VBUS CC1 CC2 PD_VCONN5V PD_IRQB

Pin connection Short to VBUS Floating Floating Short to GND Floating Short to VBUS Short to CC1 Short to CC2 Short to GND Pull-high Short to VBUS Short to CC1 Short to CC2 Connect to VSYS Pull-high Short to VBUS Short to CC1 Short to CC2 Short to GND Pull-high

99

USB PD: Watchdog Addrress

Bit

BitName

Default

Type

0x19

5

ENABLE_WATCHDOG_TIMER

0

RW

0xBD

3:0

WATCHDOG_SEL

1011

RW

0x10~0x11

7:0

ALERT

0

RW

0x12~0x13

7:0

ALERT_MASK

0

RW

Description 1: Enable the watchdog. 0: Disable the watchdog. watchdog timeout time = (WATCHDOG_SEL+1) * 0.4 sec 1b: PD interrupt 0b: Interrupt masked, 1b: Interrupt unmasked

0x19[5]=1b: 0x98[2] will be 1b after 0x19[5]=1b by watchdog timeout time (0xBD[3:0].) 0x19[5]=0b: Disable PD Watch Dog Function. Alert_mask=1b: While Alert bit=1b, PD_IRQB will be low. Alert_mask=0b: While Alert bit=1b, PD_IRQB will not be low. Alert bit =1b Alert will be 1b after 0x19[5]=1b by watchdog timeout time (0xBD[3:0]). Writing this bit as “1” to clear this bit. Alert bit = 0b PD Watch Dog event does not yet happen. CONFIDENTIAL B

2019/10/1

100

USB PD: I2C Reset Address

Bit

BitName

Default

Type

0xBF

7

I2C_TO_RST_EN

0

RW

0xBF

3:0

I2C_TO_RST_SEL

1000

RW

Description 1: Enable the I2C timeout reset function. (SCL and SDA keep low) timeout time = (I2C_TO_RST_SEL+1) * 12.5ms

0xBF[7]=1b: SCL and SDA are low for the timeout time (0xBF[3:0].) MT6360 will soft-reset PD function. 0xBF[7]=0b: MT6360 will not soft-reset PD function automatically while SCL and SDA are low for INT timeout time (0x9C[1:0].)

CONFIDENTIAL B

101

USB PD: Idle Mode Address Bit 0x8F 0x8F

3

BitName AUTOIDLE_EN

2:0 AUTOIDLE_TIMEOUT

Default Type 0 000

Description

1 : Auto enter idle mode enable 0 : Auto enter idle mode disable Enter idle mode timeout time = RW (AUTOIDLE_TIMEOUT*2+1)*6.4ms RW

0x8F[3]=1b: PD function will enter Idle mode automatically while PD_CCx does not communicate (receiving or transmission) for “Enter idel mode timeout time” (0x8F[2:0]) As PD_CCx communicates (receiving or transmission,) PD function will exit from idle mode automatically. 0x8F[3]=0b: PD function will not enter Idle mode automatically while PD_CCx does not communicate (receiving or transmission) for “Enter idel mode timeout time” (0x8F[2:0])

CONFIDENTIAL B

102

USB PD: Shipping Mode Address

Bit

BitName

Default

Type

0x8F

5

SHIPPING_OFF

0

RW

Description 0: Shipping mode 1: Non-shipping mode

0x8F[5]=1b: PD function will exit from shipping mode. 0x8F[5]=0b: PD function will be in shipping mode after MT6360 power on.

CONFIDENTIAL B

103

Content ▪ MT6360 Introduction ▪ Function Description • • • • • • • •

General Charger Flash LED Driver RGB Buck LDO USB PD Rust Protection

▪ PCB Layout Guideline CONFIDENTIAL B

104

RUST Protection Function Purpose: 1. 2. • • •

Rust prevention: Avoid rust on the connector pins that disable VBUS@DRP Rust protection: Detect the water to avoid plugin adaptor and charging Rust prevention apply low CC pin voltage and low pull up current source (Rp) to avoid rust on the connector pins. The reaction with the liquid during VBUS/CC supply is the main cause of rust. Rust protection judge there is liquid in the connector within 100ms after the port is attached. If it is determined that there is liquid on the connector , the VBUS is not provided.

CONFIDENTIAL B

-105-

RUST Protection: HW Connection ▪ MT6360’s USB_ID connect to SUB1/2 on USB-C connector. ▪ When CC pin is attached and then trigger SBU pin detect • The phone don’t support alternate mode and rust detection coexist.

▪ Apply USB_ID for water/ foreign object impedance detection Connector

VBUS

VBUS

CC1

CC1

CC2

CC2

D+ DSBU1/2

R/L R/L

DP

MT6360 Charger

DM USB_ID

DP GND

DM

AP USB PHY

Phone CONFIDENTIAL B

-106-

RUST Detection ▪ Detection process SW Enable

Trigger Event

1. CC1/2 Attached (CC1/2 8mil * N (ball number) + M (ball pitch)). (Fig.1~2)

-

Buck GND balls should be connected to buck capacitors first and isolated from the nearby GND trace and plane then connected to main GND at L3 (Fig.1~2).

Fig.1

Fig.2

MT6360

CONFIDENTIAL B

BUCK GND is isolated from nearby GND trace and plane.

115

Layout: MT6360 Buck Output (1/2) 

The buck inductors should be placed near MT6360. (Fig.1)



The output current is shown in Fig.2. Fig.2 DC/DC Output Current (mA) BUCK1 3000 (APU) BUCK2 3000 (VDRAM1)

Fig.1

MT6360

CONFIDENTIAL B

116

Layout: MT6360 Buck Output (2/2) 

Those signals are differential pairs and should be shielded by GND and far away from noise signals (Fig.1 ~ Fig.2). 1. BUCK1_VOUT / BUCK1_RSGND 2. BUCK2_VOUT / BUCK2_RSGND Fig. 2 Fig. 1

CONFIDENTIAL B

117

Layout: MT6360 LDO Output 

See table. for the suggested LDO output layout.

1. Trace width≧6mil 2. Value and placement of capacitor please refer design notice Trace Trace Rpcb Ball name Imax Length Width H=50um, 1/3 oz LDO1 300mA 1500mil 6mil 400mΩ (VFP) LDO2 300mA 1500mil 6mil 400mΩ (VTP) LDO3 300mA 1500mil 6mil 400mΩ (VMC) LDO5 800mA 1500mil 20mil 120mΩ (VMCH) LDO6 300mA Follow MMD/MES (VMDDR) LDO7 800mA Follow MMD/MES (VDRAM2)

CONFIDENTIAL B



Trace width/length can adjust by application Imax

If trace is series 0Ω resister, 0Ω resister is having 0~50mΩ variation. It would be drop voltage.

118

Chip Placement Recommendation  Following PCB layout are recommended by MTK for WLCSP (MT6359 / MT6360) 1. Opposite shield frame could not overlap package outline 2. The opposite chip (especially large chip, ex. AP & eMCP) could not overlap package outline 3. If underfill was adopted, the properties were recommended : - CTE-1 < 30 ppm/˚C, Tg > 125 ˚C

CONFIDENTIAL B

Copyright © MediaTek Inc. All rights reserved.

2019/10/1

119

Part

USB PD

Charger

FLED

ISINK LDO

Connection for Un-used Pin Function portfolio

Pin Name

PD_VBUS Unused Type-C PD_CC1 Unused PD PD_CC2 PD_IRQB (Unused E-marked) PD_VCONN5V No charger detection ILIM No charging D+, Dport detection No USB OTG USB_ID detection No charger OVP CHG_VBATOVPB detection No temperature VREF_TS/TS detection FL_VMID FL_LEDCS1 FL_LEDCS2 Camera Flash Driver FL_VINTORH FL_TORCH FL_STROBE FL_TXMASK Current Driver RGB_ISINK1/2/3, ML_ISINK LDO_VIN1/2 LDO LDO1/2/3/5 CONFIDENTIAL B

Pin connection Short to VBUS Floating Floating Floating Short to GND Floating Floating Floating Floating TS short to VREF_TS VMID Floating Floating VSYS GND GND GND Floating VSYS Floating 120

Copyright © MediaTek Inc. All rights reserved.